This case study tracks the evolution of a smart-grid sensor from its first breadboard iteration to a full production rollout.
Phase 1: The Breadboard Prototype
Messy wiring and basic functionality. The goal here was validating the logic, not aesthetics or space efficiency.
Phase 2: The First Custom PCB
The first custom PCB. We reduced the footprint by 60% and integrated the power management circuitry into the main board.
Phase 3: Scaling to Production
Scaling to 10,000 units required a complete overhaul of the DFM. We optimized for automated pick-and-place assembly, reducing manufacturing time per unit by 4 minutes.